SSOP electronic component
This is a model of a SSOP component with a non-uniform heat load on the silicon die. A 2D DXF file was imported, automeshed then extruded into the 3D geometry. Even though the die is attached to a copper pad which is exposed on the underside of the package, this simulation fixes the lead tips are 0C.
Click to enlarge
© 2011 Harley Thermal LLC email@example.com