Solaria Thermal Software
Consulting
Support
FAQ
Site Map
Contact Us
Resource Center


10 Minute Introduction


Example Models


Online tutorials

Demo Download

SolariaPCB

Download brochure
Solaria was designed by thermal analysts, for thermal analysts.
MMIC Front End for Solaria
The dialog shown below is the main dialog used to define geometry, materials, boundary conditions and power. 
A power stage is defined using the dialog shown below.  The source and drain metal can be accurately represented.  The gate pitch can be constant or variable.  The device can be rotated to any angle.
The chip can be attached to any number of layers representing the carrier or package.
The dialog shown below is used to define layers.  There is no limit to the number of layers you can add.  As you can see, the location of every type of device can be defined relative to the center or the lower left corner.
Any number of vias can be added.  They can be circular or rectangular.  Their location can be defined by a power stage.  If done so, if the power stage is rotated or moved, the via will go with it.
Gate pitch can be uniform and non-uniform as shown below.  The view can be in wireframe or solid view.
Vias can be circular or rectangular
Devices can be any orientation.  Vias can be associated with a Device so they are moved and rotated with the Device.
Surface metallization can be defined using the dialog shown below.  In the picture above, the dark blue areas are surface metallization. Their location can be relative to a power stage.  If done so, if the power stage is rotated or moved, the metallization will go with it.
Viewing in transparent mode allows you to see into the geometry.
Exposed thermal pad under package
Over mold can be defined.
Source vias can automatically be generated under each Source metal.
Air bridges can connect Source metal. Here Surface metallization connects Source vias with Source metal.
Solve the model for temperatures in just seconds.
You can easily plot the temperature profile over the chip surface by selecting a single node.
The president of Harley Thermal has been involved in the design of RF Power Amplifiers since the 1980's. Many of our past and present customers use Solaria to design these RF Power Amplifiers.  Their thermal simulation is rather unique in that the geometry spans from the sub-micron level to package dimensions in inches.  This all needs to be done in a single accurate thermal model.  Solaria has the capabilities to easily handle this as well as efficiently solve for steady state and, more importantly, transient temperatures.  Thermal properties can be temperature dependent as well as directional dependent.

Harley Thermal has developed a MMIC (Monolithic Microwave Integrated Circuits) Front End for Solaria.  This front end allows the user to define geometry and select materials for the device.  Once defined, a full 3D ready to solve Solaria model is automatically created.

The amplifier chip can be made of any material.  All materials can be temperature dependent. 
Click on the picture below to watch the introductory audio/video on the MMIC Front End

© 2017 Harley Thermal LLC                                                                                                                                            info@solariathermal.com
This page has been visited 17670 times!